Siltectra is a young, innovative company, specializing in new Wafering technologies. Founded in 2010 in Dresden, Germany, Siltectra employs a small but expert team.

Being dedicated to the development of new and efficient cost saving technologies, Siltectra enables the rapid profitable growth of next-gen technologies based on SiC. The need for SiC wafers is increasing exponentially and Siltectra’s COLD SPLIT technology increases manufacturing efficiency by 90% compared to traditional processes.

Siltectra operates from a powerful Intellectual Property position, with 13 worldwide patents granted and more than 57 patent families pending. Backed by MIG Investors, Siltectra is currently working to introduce their unique wafer splitting technology to the marketplace.