News / 23. Februar 2018

(English) SILTECTRA expands Headquarters in Dresden

DRESDEN, Germany, Feb 19, 2018 – In a move that marks its shift to production, SILTECTRA GmbH today announced that it recently expanded its headquarters in Dresden’s Technologie Park Nord and added a state-of-the-art pilot production line to the larger 900 square meter facility. The company provides advanced wafering technology solutions and services to the global semiconductor industry.

At the heart of the pilot production line is the company’s COLD SPLIT equipment. COLD SPLIT is SILTECTRA’s laser-based wafer-thinning solution. It’s a new class of wafering technology with dramatic cost advantages for manufacturers of IC devices based on advanced substrates like silicon carbide (SiC), gallium nitride (GaN), and sapphire, as well as silicon. The advanced substrates are the ideal building blocks of power electronics, RF, and optoelectronic devices. The pilot line is already processing customers’ substrates.

The new pilot line is a central piece of SILTECTRA’S growth strategy and the timing is excellent, says the company’s CEO, Dr. Harald Binder. “With the industry steadily transitioning to advanced substrates to build devices like power electronics, there is soaring interest in new technologies that can improve performance and contain costs. We’re hearing daily from leading integrated device manufacturers (IDMs) who are eyeing advanced wafering technologies, in particular, to exact cost-reductions in their mass-production fabs. This has generated high interest in our COLD SPLIT technology. We’re very pleased now to have advanced capabilities to cater to these customers.”

SILTECTRA’S CTO, Dr. Jan Richter, added, “The pilot line gives us the critical infrastructure to accelerate our path to production and expand R&D to hit aggressive milestones on our technology roadmap. COLD SPLIT is already out-performing traditional grinding methods by thinning wafers to 100 microns and below in minutes, with virtually no material loss. Now, we’re in final-phase testing of extended capabilities that exploit the technology’s maximum potential. Results so far are very exciting. We believe that the additional innovations have the potential to deliver substantial cost savings to manufacturers of SiC-based devices.”

SILTECTRA provides advanced wafering technology solutions and services to global semiconductor manufacturers. The company’s proprietary COLD SPLIT solution thins wafer substrates to 100 microns and below in minutes, with virtually no material loss. With a specialized focus on advanced substrate materials like silicon carbide (SiC), gallium nitride (GaN) and sapphire, SILTECTRA’s laser-based technology equipment and process solution is enabling manufacturers of power electronics, RF and other IC devices with dramatic new performance and cost advantages. Founded in 2010 and headquartered in Dresden, Germany, SILTECTRA is privately held and supported by a leading venture capital firm.

Johannes Froehling; Email: